MIT Lincoln Laboratory developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The test chip could help government and industry overcome long-held challenges in developing 3D heterogenous integrated (3DHI) systems, enabling more powerful microelectronics systems in smaller packages.. The bound chips are annealed, expanding the copper to form a conductive connection [bottom]. Hybrid bonding binds copper pads at the top of a chip’s interconnect stack directly to the copper.
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Stack of chips has two meanings and we explain both in our online dictionary.. Imagine building a skyscraper of semiconductors instead of a sprawling suburb. MIT engineers have done just that, stacking chips for exponential power gains.
